Heat Reducing Using Peltier Effect on Smart Phones

Authors(4) :-Jeyavarthni. M, Dr. D. Ravindran, R. Stephan, M. Vasantha Kanesh

This is the paper presents how the peltier effect can reduce the smart phone’s heat using a trigger circuit. A smart phone case is constructed with a peltier tile, a heat-sensing sensor, and a heat sink. That case will be get connected with a trigger circuit, which consist of some hardware like transistor, IC555processor, relay, switch, biaser, buzzer, heat sink and a variable resistor. Using these components how would be the smart phone’s heat will get reduced is a concept that this paper has been discussed

Authors and Affiliations

Jeyavarthni. M
Department of Computer Science/St.Joseph’s College, Trichirappalli, Tamilnadu, India
Dr. D. Ravindran
Associate Professor and Research Supervisor, Department of Computer Science, St.Joseph's College/Trichirappalli, Tamilnadu, India
R. Stephan
Ph.D Scholar, Department of Computer Science, St.Joseph's College, Trichirappalli, Tamilnadu, India
M. Vasantha Kanesh
B.tech Scholar, Department of Aero Space Engg. Karunya Universitry, Coimbatore, Tamilnadu, India

Peltier Tile, Heat Sensing Sensor, IC555 Processor, LM35,Relay, Variable Resistor, Heat Sink

  1. Yahya Sheikhnejad, Ricardo Bastos, Zoran Vujicic, Ali Shahpari, Antonio Teixeira," Laser Thermal Tuning by Transient Analytical Analysis of Peltier Device",p.p1-5",IEEE,2016.
  2. Yunda Wang, David E. Schwartz, Member, IEEE, Sylvia J. Smullin, Qian Wang, and Martin J. Sheridan," Silicon Heat Switches for Electrocaloric Cooling", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, P.P1, IEEE,2017.
  3. Thomas Foulkes, Junho Oh, Patrick Birbarah, Jason Neely, Nenad Miljkovicy, Robert C.N. Pilawa Podgurski, "Active Hot Spot Cooling of GaN Transistors With ElectricField Enhanced Jumping Droplet Condensation",P.P  912-913, IEEE,2017.
  4. Daisuke Miyagi, Noriyuki Fukushima, Shuhei Sakurai, Makoto Tsuda, and Shoichi Yokoyama," Study on Thermal Measurement Method of AC Loss in a Conduction-Cooled HTS Coil", IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY,VOL.27,NO.4,P.P 1, JUNE 2017.
  5. Torsten Wilde, Michael Ott, Axel Auweter, Ingmar Meijer, Patrick Ruch, Markus Hilger, Steffen K¨uhnert, Herbert Huber," CooLMUC-2: A Supercomputing Cluster with Heat Recovery for Adsorption Cooling", 33rd SEMI-THERM Symposium, P.P 115-117,IEEE, 2017.
  6. T. Nishimura, H. Tanoue, Y. Oodate, H. 1. Mattausch, M. Miura-Mattausch," Measurement and Modeling of  IC Self-Heating Including Cooling System Properties",P.P 90,IEEE,2015.
  7. Kaoru Furumi, Masashi Imai, Atsushi Kurokawa," Cooling Architectures using Thermal Sidewalls, Interchip Plates, and Bottom Plate for 3D ICs", 18th Int'l Symposium on Quality Electronic Design, p.p 283, IEEE, 2017.
  8. Gregory Paul and Edward Gim, David Westerfeld," Battery Powered Heating and Cooling Suit",P.P1-3,IEEE,2014.

Publication Details

Published in : Volume 2 | Issue 4 | July-August 2017
Date of Publication : 2017-08-31
License:  This work is licensed under a Creative Commons Attribution 4.0 International License.
Page(s) : 823-831
Manuscript Number : CSEIT1724201
Publisher : Technoscience Academy

ISSN : 2456-3307

Cite This Article :

Jeyavarthni. M, Dr. D. Ravindran, R. Stephan, M. Vasantha Kanesh, "Heat Reducing Using Peltier Effect on Smart Phones", International Journal of Scientific Research in Computer Science, Engineering and Information Technology (IJSRCSEIT), ISSN : 2456-3307, Volume 2, Issue 4, pp.823-831, July-August-2017.
Journal URL : http://ijsrcseit.com/CSEIT1724201

Article Preview