Numerical Modeling on Electronics Module Cooling by Using TiO2, Al and CuO Water Based Nanofluids
Keywords:
Electronics Module, Simulation, Nanofluids, Water-TiO2, Water-Al, Water-CuOAbstract
The conventional air cooling technique is no longer adequate for high heat flux electronics components. For that, the thermal management of electronics module is very much important to its smooth operation. The present study involves an electronics module kept horizontally at the base, inside a square shaped chamber filled with nanofluid as coolant. Three different water based nanofluids, namely Water-TiO2, Water-Al and Water-CuO, are considered as coolants in the present investigations. The numerical studies are carried out to obtain the heat transfer behavior of electronics module for maintaining its temperature within the safe limit. For that, a 2D numerical model is being developed which also includes thermal buoyancy. The continuity, momentum and energy equations are solved to predict the thermal behavior. The simulations are performed to predict the temperature fields and temperature contours. The trends of results are along the expected lines. Simulation results predicted with three different water based nanofluids are analyzed and compared for realizing the relative importance of the stated nanofluids. The key model parameter considered is heat flux of 70 W/cm2 associated with the electronics module. The Water-Al is identified as the nanofluid giving the superior cooling effect to electronics module without any such thermal failure.
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