Numerical Investigation on Electronic Cabinet with interrupted Fin heat sink using CFD

Authors

  • Lakshminarasimha N  Assistant Professor, Mechanical Engineering Department, New Horizon College of Engineering, Bengaluru, Karnataka, India
  • Dr. M S Rajagopal  Professor and Chairman, Mechanical Engineering Department, Dayananda Sagar University, Bengaluru, Karnataka, India
  • Megaha Shukla  Assistant Professor, Mechanical Engineering Department, New Horizon College of Engineering, Bengaluru, Karnataka, India

Keywords:

Temperature rise, fin heat sink, CFD, ANSYS Fluent, Electronic Cabinet

Abstract

Heat dissipation is one of the most challenging tasks in any product design more so in thermal design of Electronic Cabinets, as heat generated by these components may exceed its operating temperature limits leading to failure of components. Research shows that, for every 100C temperature rise above ambient temperature of the Cabinet, the life of the electronic components is reduced by half. Hence limiting the temperature of components below its operating temperature range becomes a major criterion in designing any electronic system. In this present work, CFD analysis has been carried out using ANSYS Fluent on Electronic Cabinet of size 358mm x 78mm x 252mm consisting five heat sources with total heat dissipation of 150W. Cabinet is designed for two exhaust fans each of 48 CFM. The analysis is carried out by providing interrupted fin heat sink. The results of interrupted fin heat sink are compared with the results of continuous fin heat sink. It is found that nearly there is 2% reduction in the pumping power cost using interrupted fin heat sink due to lower pressure drop and also installing interrupted fin heat sink reduces the weight of the Electronic system. The result obtained for temperature rise in a Cabinetfound to be 30C which is below the threshold limit. Analysis results of temperature rise and inlet velocity was validated with analytical results and hence satisfies.

References

[1] Hoffman- A Pentair Company, “Heat dissipation in Electrical enclosure”, “Technical information on Thermal Management of Electrical enclosures”, ©2003 Hoffman Enclosures Inc.
[2] MahendraWankhede, VivekKhaire, Dr. AvijitGoswami and Prof. S. D. Mahajan, “Evaluation of cooling solutions for outdoor electronics”, Journal on electronics cooling from electronics-cooling.com, Volume 16, No. 3, Fall 2010
[3] Lakshminarasimha N, “Numerical Investigation of forced convection cooling of Electrical enclosure using CFD”, Journal of Engineering Research and Applications, ISSN: 2248-9622, Vol. 5, Issue 11, (Part - 5) November 2015, pp.62-66
[4] Bud Industries, Inc., “Enclosure Design Tips Handbook”, July 2007, © Bud Industries Inc.
[5] ANSYS Fluent User Guide, Release 15.0, Nov. 2013 and ANSYS Fluent 12.0, Theory guide, April 2009
[6] H K Versteeg and W Malalasekara, “Computational Fluid Dynamics- Finite Volume Method”, Text book of CFD, edition 1995
[7] R. K. Rajput, “Heat and Mass Transfer”, Text book edition 2009-2010

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Published

2018-04-14

Issue

Section

Research Articles

How to Cite

[1]
Lakshminarasimha N, Dr. M S Rajagopal, Megaha Shukla, " Numerical Investigation on Electronic Cabinet with interrupted Fin heat sink using CFD, IInternational Journal of Scientific Research in Computer Science, Engineering and Information Technology(IJSRCSEIT), ISSN : 2456-3307, Volume 4, Issue 5, pp.150-154, March-April-2018.