Magic XPI Integration Component - EDI

Authors

  • Prof.(Dr.) S. T. Patil  Department of computer Engineering, Vishwakarma Institute of Technology, Pune, Maharashtra, India
  • Surabhi Jadhav  Department of computer Engineering, Vishwakarma Institute of Technology, Pune, Maharashtra, India

DOI:

https://doi.org//10.32628/CSEIT2173133

Keywords:

Communication Standards, B2B, EDI Service

Abstract

The electronic data exchange between B2B partners through EDI (Electronic Data Interchange) enables your company to continuously digitize and automate business processes. This results in more efficiency and easy, as well as cost savings as per document, but requires the support of different formats, message standards, and communication protocols. Organization offers a standard solution for B2B integration and electronic data exchange with the Magic EDI Service Platform. Whether you are a customer, supplier you can now exchange data electronically with all your partners.

References

  1. The Future of EDI: An IBM point of view
  2. Electronic data interchanges, (link resides outside ibm.com)" Wikipedia
  3. "EDI and B2B basics, (link resides outside ibm.com)" Sriniedibasics, 20 Aug 2011
  4. "The future of EDI: An IBM point-of-view (PDF, 411 KB)" IBM Watson Supply Chain, Oct 2018
  5. Seven key drivers for modernizing your B2B architecture | I
  6. What is B2B integration? | IBM
  7. B2B collaboration solutions | IBM

IInternational Journal of Scientific Research in Computer Science, Engineering and Information Technology

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Published

2021-06-30

Issue

Volume 7, Issue 3, May-June-2021

Section

Research Articles

License

Copyright (c) IJSRCSEIT

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.

How to Cite

[1]
Prof.(Dr.) S. T. Patil, Surabhi Jadhav, " Magic XPI Integration Component - EDI , IInternational Journal of Scientific Research in Computer Science, Engineering and Information Technology(IJSRCSEIT), ISSN : 2456-3307, Volume 7, Issue 3, pp.611-614, May-June-2021. Available at doi : https://doi.org/10.32628/CSEIT2173133